Modeling, Design, Fabrication and Demonstration of RF Front-End 3D IPAC Module with Ultra-thin Glass Substrates for LTE Applications

This paper demonstrates, for the first time, an integrated radio frequency (RF) front-end module (FEM) with precision matching circuits in ultra-miniaturized glass substrates for LTE applications. Through full-wave electromagnetic (EM) simulations, electrical performance of these glass-based long term evolution (LTE) packages is compared with traditional RF modules with surface mount devices (SMDs), and organic laminates with embedded passives and actives. RF front-end modules with 3D or double-side thinfilm passive components on glass-based substrates are fabricated and characterized to correlate their performance with EM simulations.